AMD C-30 kontra AMD E1-1200. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  AMD C AMD E
• Pokolenie
  1 1
• Grupa CPU
  AMD C AMD E1/E2-1000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.20 GHz 1.40 GHz
• Rdzenie CPU
  1 2
• Turbo (1 rdzeń)
  No turbo No turbo
• CPU Threads
  1 2
• Hyperthreading
  Nie Nie
• Overclocking
  Tak Nie
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon HD 6250 AMD Radeon HD 7310
• GPU frequency
  0.28 GHz 0.53 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  1 1
• Shader
  80 80
• Max. GPU Memory
  1 GB 1 GB
• Max. displays
  2 2
• Pokolenie
  3 4
• DirectX Version
  11 11
• Proces technologiczny
  40 nm 40 nm
• Data wydania
  Q4/2010 Q2/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode Decode
• VP9
  Nie Nie
• VP8
  Nie Nie
• AV1
  Nie Nie
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD E1-1200 oraz AMD C-30. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR3-1066 DDR3-1066
• ECC
  Nie Nie
• Kanały pamięci
  1 1

• AES-NI
  Nie Tak

Analyze the TDP (Thermal Design Power) requirements of AMD C-30 oraz AMD E1-1200 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 18 W

Information on architecture, interfaces, and additional instructions supported by AMD C-30 oraz AMD E1-1200, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Wirtualizacja
  AMD-V AMD-V
• Rozszerzenia ISA
  SSE3, SSE4a SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  1.00 MB 1.00 MB
• Architektura
  Ontario (Bobcat) Zacate (Bobcat)
• Proces technologiczny
  40 nm 32 nm
• Gniazdo
  BGA 413 BGA 413
• Data wydania
  Q1/2011 Q3/2012