AMD EPYC 9684X kontra AMD Ryzen Embedded V3C16. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  AMD EPYC AMD Ryzen Embedded V
• Grupa CPU
  AMD EPYC 9004 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  4 3
• Model z przeszłości
  -- AMD Ryzen Embedded V2516

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  96 / 192 6 / 12
• Architektura podstawowa
  normal normal
• Rdzenie
  96x Zen 4 6x Zen 3
• Hyperthreading / SMT
  Tak Tak
• Overclocking
  Nie Nie
• Częstotliwość
  2.55 GHz 2.00 GHz
• Turbo Frequency (1 Core)
  3.70 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU brak iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C16 oraz AMD EPYC 9684X. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR5-4800 DDR5-4800
• Max. Pamięć
  6144 GB 64 GB
• Kanały pamięci
  12 2 (Dual Channel)
• Bandwidth
  461.0 GB/s 76.8 GB/s
• ECC
  Tak Tak
• PCIe
  5.0 x 128 4.0 x 20
• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD EPYC 9684X oraz AMD Ryzen Embedded V3C16 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  -- 25 W
• TDP down
  320 W 10 W
• Temperatura maksymalna
  100 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by AMD EPYC 9684X oraz AMD Ryzen Embedded V3C16, including virtual machine technologies and fabrication processes.

• Proces technologiczny
  5 nm 6 nm
• Chip design
  Chiplet Chiplet
• Gniazdo
  SP5 FP7r2
• L2-Cache
  -- 3.00 MB
• L3-Cache
  1,152.00 MB 16.00 MB
• Architektura
  Genoa / Genoa-X (Zen 4) Rembrandt (Zen 3+)
• Operating systems
  Windows Server 2022, Linux, Windows 11 Windows 10, Windows 11, Linux
• Wirtualizacja
  AMD-V, SVM AMD-V, SVM
• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Data wydania
  Q2/2023 Q3/2022
• Release price
  14756 $ --
• specyfikacja
  Technical data sheet Technical data sheet