AMD Epyc Embedded 3351 kontra Intel Celeron G5900. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  AMD Epyc Intel Celeron
• Grupa CPU
  AMD Epyc Embedded 3000 Intel Celeron G5000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  1 9
• Successor
  -- Intel Celeron G5905

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal normal
• Overclocking
  Tak Nie
• Częstotliwość
  1.90 GHz 3.40 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU Intel HD Graphics 610
• GPU frequency
  0.35 GHz
• GPU (Turbo)
  No turbo 1.05 GHz
• Jednostki wykonawcze
  12
• Shader
  96
• Max. GPU Memory
  -- 32 GB
• Max. displays
  3
• Pokolenie
  9.5
• Proces technologiczny
  14 nm
• Data wydania
  Q3/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Intel Celeron G5900 oraz AMD Epyc Embedded 3351. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2666 DDR4-2666
• Max. Pamięć
  1024 GB 128 GB
• Kanały pamięci
  4 2
• ECC
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Epyc Embedded 3351 oraz Intel Celeron G5900 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  80 W 58 W
• TDP down
  60 W --
• Temperatura maksymalna
  105 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Epyc Embedded 3351 oraz Intel Celeron G5900, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2
• L2-Cache
  6.00 MB --
• L3-Cache
  32.00 MB 2.00 MB
• Architektura
  Snowy Owl (Zen) Comet Lake S
• Proces technologiczny
  14 nm 14 nm
• Wirtualizacja
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Gniazdo
  SP4 LGA 1200
• Data wydania
  Q1/2018 Q2/2020