AMD Sempron 2650 kontra AMD Sempron 3850. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Seria
  AMD Sempron AMD Sempron
• Pokolenie
  1 1
• Grupa CPU
  AMD Sempron 2000/3000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.45 GHz 1.30 GHz
• Rdzenie CPU
  2 4
• Turbo (1 rdzeń)
  No turbo No turbo
• CPU Threads
  2 4
• Hyperthreading
  Nie Nie
• Overclocking
  Tak Tak
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon HD 8240 AMD Radeon HD 8280
• GPU frequency
  0.40 GHz 0.45 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  2 2
• Shader
  128 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  2 2
• Pokolenie
  5 5
• DirectX Version
  11.1 11.1
• Proces technologiczny
  28 nm 28 nm
• Data wydania
  Q2/2013 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode Decode
• VP9
  Nie Nie
• VP8
  Nie Nie
• AV1
  Nie Nie
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 3850 oraz AMD Sempron 2650. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR3L-1333 SO-DIMM DDR3L-1600 SO-DIMM
• ECC
  Nie Nie
• Kanały pamięci
  1 1

• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Sempron 2650 oraz AMD Sempron 3850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  25 W 25 W

Information on architecture, interfaces, and additional instructions supported by AMD Sempron 2650 oraz AMD Sempron 3850, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Wirtualizacja
  AMD-V AMD-V
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  1.00 MB 2.00 MB
• Architektura
  Kabini (Jaguar) Kabini (Jaguar)
• Proces technologiczny
  28 nm 28 nm
• Gniazdo
  AM1 AM1
• Data wydania
  Q2/2014 Q2/2014