Intel Xeon D-1637 kontra AMD Ryzen Embedded V1605B. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Intel Xeon D AMD Ryzen Embedded
• Grupa CPU
  Intel Xeon D-1600 AMD Ryzen Embedded V1000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal normal
• Overclocking
  Nie Nie
• Częstotliwość
  2.90 GHz 2.00 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU AMD Radeon Vega 8 Graphics
• GPU frequency
  1.10 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  8
• Shader
  512
• Max. GPU Memory
  -- 2 GB
• Max. displays
  3
• Pokolenie
  8
• Proces technologiczny
  14 nm
• Data wydania
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V1605B oraz Intel Xeon D-1637. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2400 DDR4-2400
• Max. Pamięć
  128 GB 32 GB
• Kanały pamięci
  2 2
• ECC
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon D-1637 oraz AMD Ryzen Embedded V1605B to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  55 W 15 W
• TDP up
  -- 25 W
• TDP down
  -- 12 W
• Temperatura maksymalna
  -- 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon D-1637 oraz AMD Ryzen Embedded V1605B, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4.1, SSE4.2, AVX2 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  9.00 MB --
• L3-Cache
  -- 4.00 MB
• Architektura
  Hewitt Lake Great Horned Owl (Zen)
• Proces technologiczny
  14 nm 14 nm
• Wirtualizacja
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• Gniazdo
  BGA 1667 FP5
• Data wydania
  Q2/2019 Q1/2018