Intel Xeon D-1714 kontra AMD Epyc Embedded 3351. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Intel Xeon D AMD Epyc
• Grupa CPU
  Intel Xeon D-1700 AMD Epyc Embedded 3000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  4 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 8 12 / 24
• Architektura podstawowa
  normal normal
• Rdzenie
  4x Sunny Cove 12x
• Hyperthreading / SMT
  Tak Tak
• Overclocking
  Nie Tak
• Częstotliwość
  2.30 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  3.40 GHz 3.00 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU brak iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by AMD Epyc Embedded 3351 oraz Intel Xeon D-1714. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2666 DDR4-2666
• Max. Pamięć
  256 GB 1024 GB
• Kanały pamięci
  2 4
• Bandwidth
  42.7 GB/s 85.3 GB/s
• ECC
  Tak Tak
• PCIe
  4.0 x 16 3.0 x 64
• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon D-1714 oraz AMD Epyc Embedded 3351 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  38 W 80 W
• TDP down
  -- 60 W
• Temperatura maksymalna
  -- 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon D-1714 oraz AMD Epyc Embedded 3351, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4.1, SSE4.2, AVX2, AVX-512 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  10.00 MB 6.00 MB
• L3-Cache
  -- 32.00 MB
• Architektura
  Ice Lake Snowy Owl (Zen)
• Proces technologiczny
  10 nm 14 nm
• Wirtualizacja
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• Gniazdo
  BGA 2227 SP4
• Data wydania
  Q1/2022 Q1/2018