Qualcomm Snapdragon 7 Gen 1 kontra Apple M1 Max (32-GPU). Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Apple M series
• Grupa CPU
  Qualcomm Snapdragon 7/8 Gen 1 Apple M1
• Segment
  Mobile Mobile
• Pokolenie
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 10 / 10
• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x 8x Firestorm
• B-Core
  2x 2x Icestorm
• C-Core
  3x --
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU Apple M1 Max (32 Core)
• GPU frequency
  1.30 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  512
• Shader
  4096
• Max. GPU Memory
  -- 32 GB
• Max. displays
  3
• Pokolenie
  1
• Proces technologiczny
  5 nm
• Data wydania
  Q3/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP8
  Nie Decode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 Max (32-GPU) oraz Qualcomm Snapdragon 7 Gen 1. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR5-6400 LPDDR5-6400
• Max. Pamięć
  16 GB 64 GB
• Kanały pamięci
  4 4
• ECC
  Nie Nie
• PCIe
  4.0
• AES-NI
  Nie Tak

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7 Gen 1 oraz Apple M1 Max (32-GPU) to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  30 W
• TDP up
  -- 60 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7 Gen 1 oraz Apple M1 Max (32-GPU), including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  Rosetta 2 x86-Emulation
• L2-Cache
  2.00 MB 28.00 MB
• L3-Cache
  4.00 MB --
• Architektura
  Cortex-X2 / -A710 / -A510 M1
• Proces technologiczny
  4 nm 5 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2022 Q3/2021
• Part Number
  SM8475 APL 1104