Qualcomm Snapdragon 835 kontra Qualcomm Snapdragon 425. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  4 3
• Grupa CPU
  Qualcomm Snapdragon 830 Qualcomm Snapdragon 425/427

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.90 GHz 1.40 GHz
• Rdzenie CPU
  8 4
• Turbo (1 rdzeń)
  2.45 GHz 1.40 GHz
• CPU Threads
  8 4
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 280 Gold --
• B core
  4x Kryo 280 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 540 Qualcomm Adreno 308
• GPU frequency
  0.71 GHz 0.50 GHz
• GPU (Turbo)
  0.71 GHz 0.50 GHz
• Shader
  384 24
• Pokolenie
  5 3
• DirectX Version
  11.1 11
• Proces technologiczny
  10 nm 28 nm
• Data wydania
  Q1/2017 Q1/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode Decode / Encode
• VP9
  Decode Nie
• VP8
  Decode Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 425 oraz Qualcomm Snapdragon 835. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1866 LPDDR3-667
• ECC
  Nie Nie
• Kanały pamięci
  2 1

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 835 oraz Qualcomm Snapdragon 425 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 835 oraz Qualcomm Snapdragon 425, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Kryo 280 Cortex-A53
• Proces technologiczny
  10 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2017 Q3/2016
• Part Number
  MSM8998 MSM8917