Raspberry Pi 3 B+ (Broadcom BCM2837B0) kontra HiSilicon Kirin 9000. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Mobile
• Seria
  Broadcom BCM HiSilicon Kirin
• Pokolenie
  3 9
• Grupa CPU
  Broadcom BCM2837B0 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.40 GHz 2.05 GHz
• Rdzenie CPU
  4 8
• Turbo (1 rdzeń)
  No turbo 3.13 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nie Nie
• Overclocking
  Tak Nie
• Architektura podstawowa
  normal hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A53 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Broadcom VideoCore 5 ARM Mali-G78 MP24
• GPU frequency
  0.40 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  2 24
• Shader
  24 384
• Max. GPU Memory
  1 GB --
• Max. displays
  2 1
• Pokolenie
  5 Vallhall 2
• DirectX Version
  12
• Proces technologiczny
  40 nm 5 nm
• Data wydania
  02/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Nie Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 oraz Raspberry Pi 3 B+ (Broadcom BCM2837B0). The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR2 LPDDR4X-2133LPDDR5-2750
• Max. Pamięć
  1024 GB
• ECC
  Nie Nie
• Kanały pamięci
  1 4

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Raspberry Pi 3 B+ (Broadcom BCM2837B0) oraz HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W
• TDP down
  4 W --

Information on architecture, interfaces, and additional instructions supported by Raspberry Pi 3 B+ (Broadcom BCM2837B0) oraz HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  0.50 MB --
• Architektura
  Cortex-A15 Cortex-A77 / Cortex-A55
• Proces technologiczny
  40 nm 5 nm
• Gniazdo
  N/A N/A
• Data wydania
  02/2016 Q4/2020