Samsung Exynos 3250 kontra Samsung Exynos 4212. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Samsung Exynos Samsung Exynos
• Grupa CPU
  Samsung Exynos 3200 Samsung Exynos 4212/4412
• Segment
  Mobile Mobile
• Pokolenie
  3 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  2 / 2 2 / 2
• Architektura podstawowa
  normal normal
• Częstotliwość
  1.00 GHz 1.50 GHz
• Turbo (1 rdzeń)
  1.00 GHz 1.50 GHz
• Turbo (2 Cores)
  1.00 GHz No turbo
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-400 MP2 ARM Mali-400 MP4
• GPU frequency
  0.45 GHz 0.40 GHz
• GPU (Turbo)
  No turbo 0.40 GHz
• Jednostki wykonawcze
  2 4
• Shader
  32 64
• Max. displays
  1 1
• Pokolenie
  Utgard Utgard
• Proces technologiczny
  28nm 28nm
• Data wydania
  Q2/2008 Q2/2008

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by Samsung Exynos 4212 oraz Samsung Exynos 3250. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR2-400 LPDDR2-400
• ECC
  Nie Nie
• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 3250 oraz Samsung Exynos 4212 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 3250 oraz Samsung Exynos 4212, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv7-A32 (32 bit) ARMv7-A32 (32 bit)
• L2-Cache
  -- 1.00 MB
• Architektura
  Cortex-A7 Cortex-A9
• Proces technologiczny
  28 nm 32 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  2014 Q3/2011