HiSilicon Kirin 710 versus HiSilicon Kirin 955. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Geração
  5 4
• Grupo CPU
  HiSilicon Kirin 710 HiSilicon Kirin 950

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.70 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.20 GHz 2.50 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  2.20 GHz 2.50 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Cortex-A72
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G51 MP4 ARM Mali-T880 MP4
• GPU frequency
  0.65 GHz 0.90 GHz
• GPU (Turbo)
  1.00 GHz 0.90 GHz
• Unidades de execução
  8 4
• Shader
  128 64
• Max. GPU Memory
  4 GB --
• Max. displays
  2 2
• Geração
  Bifrost 1 Midgard 4
• DirectX Version
  11 11
• Processo técnico
  12 nm 16 nm
• Data de lançamento
  Q2/2018 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Não
• VP8
  Decode / Encode Decode / Encode
• AV1
  Não Não
• AVC
  Decode / Encode Não
• VC-1
  Decode / Encode Não
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 955 e HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3LPDDR4 LPDDR3LPDDR4
• Máx. Memória
  6 GB
• ECC
  Não Não
• Canais de memória
  2 2

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 e HiSilicon Kirin 955 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 e HiSilicon Kirin 955, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  1.00 MB --
• Arquitectura
  Cortex-A73 / Cortex-A53 Cortex-A72 / Cortex-A53
• Processo técnico
  12 nm 16 nm
• Socket
  N/A N/A
• Data de lançamento
  Q3/2018 Q2/2016