HiSilicon Kirin 925
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Pontuação geral
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Lançado
Q3/2014
HiSilicon Kirin 925

Processador HiSilicon Kirin 925, especificações e padrões de referência

O processador HiSilicon Kirin 925 é instalado em placas com socket N/A e opera a uma frequência de 1.30 GHz. O HiSilicon Kirin 925 possui um total de 8 núcleos. Data de lançamento: Q3/2014. TDP é . Esta análise fornece todas as especificações técnicas e dados detalhados sobre o processador HiSilicon Kirin 925. Descubra tudo para saber se o jogo ou software funcionará no HiSilicon Kirin 925.

HiSilicon Kirin 925 Especificações

Dados técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Série
  • Geração
    2
  • Grupo CPU
    HiSilicon Kirin 920
  • Modelo passado
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 925. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequência
    1.30 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    1.80 GHz
  • Roscas de CPU
    8
  • Turbo (8 Cores)
    1.80 GHz
  • Hyperthreading
    Não
  • Overclocking
    Não
  • Arquitectura central
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A15
  • B core
    4x Cortex-A7
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nome da GPU
    ARM Mali-T628 MP4
  • GPU frequency
    0.60 GHz
  • GPU (Turbo)
    0.60 GHz
  • Unidades de execução
    4
  • Shader
    64
  • Max. GPU Memory
    --
  • Max. displays
    1
  • Geração
    Midgard 2
  • DirectX Version
    11
  • Processo técnico
    32nm
  • Data de lançamento
    Q4/2012
Suporte de codec de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Não
  • h265 / HEVC (10 bit)
    Não
  • h264
    Decode / Encode
  • VP9
    Não
  • VP8
    Decode / Encode
  • AV1
    Não
  • AVC
    Não
  • VC-1
    Não
  • JPEG
    Não
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memória
    LPDDR3-1600
  • Máx. Memória
  • ECC
    Não
  • Canais de memória
    2
  • Versão PCIe
  • Pistas PCIe
Criptografia

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Não
Consumo de energia
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver abaixo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Conjunto de instruções (ISA)
    ARMv7-A32 (32 bit)
  • Virtualização
    None
  • Extensões ISA
  • Кеш L2
    --
  • Кеш L3
    --
  • Arquitectura
    Cortex-A15 / Cortex-A7
  • Processo técnico
    28 nm
  • Socket
    N/A
  • Data de lançamento
    Q3/2014
  • Part Number
    --
Posições em todos os rankings

Posições comuns HiSilicon Kirin 925 CPU em padrões de referência populares, para comparação com outros modelos.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1629 place

HiSilicon Kirin 925 Benchmarks

Testes de desempenho CPU

Compare the benchmark scores of HiSilicon Kirin 925 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
O desempenho do iGPU - o GPU interno em jogos.
77
77
77
77
HiSilicon Kirin 925

Sinónimos

Processadores semelhantes em termos de desempenho.

Similar em processadores de dados técnicos com HiSilicon Kirin 925.

AMD E2-3800 Ver
AMD E-300 Ver
Apple A10 Fusion Ver
Apple A10X Fusion Ver
Apple A7 Ver
HiSilicon Kirin 920 Ver
HiSilicon Kirin 925 Ver
HiSilicon Kirin 928 Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 925

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