AMD Ryzen 5 PRO 5645 对 Apple A10 Fusion. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  AMD Ryzen 5 Apple A series
• CPU组
  AMD Ryzen 5000U Apple A10/A10X
• 分段
  Mobile Mobile
• 一代人
  4 10
• 过去的模式
  -- Apple A9
• Successor
  -- Apple A11 Bionic

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  normal hybrid (big.LITTLE)
• 超频
  是 没有
• 頻率
  3.70 GHz 1.30 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  没有iGPU Apple A10
• GPU frequency
  0.90 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  6
• 着色器
  192
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1
• 一代人
  7
• 技术过程
  16 nm
• 发布日期
  Q3/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 Decode
• h265 / HEVC (10 bit)
  没有 Decode
• h264
  没有 Decode / Encode
• VP8
  没有 Decode
• VP9
  没有 Decode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Apple A10 Fusion 和 AMD Ryzen 5 PRO 5645. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4-3200 LPDDR4-3200
• 最大内存
  64 GB 3 GB
• 记忆通道
  2 (Dual Channel) 1
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen 5 PRO 5645 和 Apple A10 Fusion to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• 最高温度
  95 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen 5 PRO 5645 和 Apple A10 Fusion, including virtual machine technologies and fabrication processes.

• 技术过程
  7 nm 10 nm
• 插座
  AM4 (PGA 1331) N/A
• L2-Cache
  3.00 MB 4.00 MB
• L2-Cache
  32.00 MB --
• 建筑学
  Cezanne (Zen 3) A10
• 虚拟化
  AMD-V, SVM None
• 指令集（ISA）
  x86-64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• 发布日期
  Q3/2022 Q3/2016
• Part Number
  100-000000833 --