AMD Ryzen 9 PRO 5945 对 AMD Ryzen 7 PRO 5845. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  AMD Ryzen 5 AMD Ryzen 5
• CPU组
  AMD Ryzen 5000U AMD Ryzen 5000U
• 分段
  Mobile Mobile
• 一代人
  4 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  12 / 24 8 / 16
• 核心架构
  normal normal
• 磁芯
  12x 8x
• Hyperthreading / SMT
  是 是
• 超频
  是 是
• 頻率
  3.00 GHz 3.40 GHz
• Turbo Frequency (1 Core)
  4.70 GHz 4.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  没有iGPU 没有iGPU
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  没有 没有
• VP8
  没有 没有
• VP9
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 没有
• JPEG
  没有 没有

Overview of the types and quantities of RAM supported by AMD Ryzen 7 PRO 5845 和 AMD Ryzen 9 PRO 5945. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4-3200 LPDDR4-3200
• 最大内存
  64 GB 64 GB
• 记忆通道
  2 (Dual Channel) 2 (Dual Channel)
• Bandwidth
  51.2 GB/s 51.2 GB/s
• ECC
  没有 没有
• PCIe
  4.0 4.0
• AES-NI
  是 是

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen 9 PRO 5945 和 AMD Ryzen 7 PRO 5845 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1 / PBP)
  65 W 65 W
• 最高温度
  95 °C 95 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen 9 PRO 5945 和 AMD Ryzen 7 PRO 5845, including virtual machine technologies and fabrication processes.

• 技术过程
  7 nm 7 nm
• Chip design
  Chiplet Chiplet
• 插座
  AM4 (PGA 1331) AM4 (PGA 1331)
• L2-Cache
  6.00 MB 4.00 MB
• L2-Cache
  64.00 MB 32.00 MB
• 建筑学
  Cezanne (Zen 3) Cezanne (Zen 3)
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• 虚拟化
  AMD-V, SVM AMD-V, SVM
• 指令集（ISA）
  x86-64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• 发布日期
  Q3/2022 Q3/2022
• Part Number
  100-000000831 100-000000832
• 规格
  Technical data sheet Technical data sheet