HiSilicon Kirin 950 对 Qualcomm Snapdragon 690. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Qualcomm Snapdragon
• 一代人
  4 8
• CPU组
  HiSilicon Kirin 950 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.70 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.30 GHz 2.00 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  2.30 GHz 1.70 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 2x Kryo 560 Gold
• B core
  4x Cortex-A53 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-T880 MP4 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  0.90 GHz 没有涡轮增压
• 执行单位
  4 0
• 着色器
  64 0
• Max. displays
  2 0
• 一代人
  Midgard 4 6
• DirectX Version
  11 12.1
• 技术过程
  16 nm 8 nm
• 发布日期
  Q2/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP9
  没有 Decode
• VP8
  Decode / Encode Decode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 和 HiSilicon Kirin 950. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4 LPDDR4X-1866
• ECC
  没有 没有
• 记忆通道
  2 2

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 950 和 Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 950 和 Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• 建筑学
  Cortex-A72 / Cortex-A53 Kryo 560
• 技术过程
  16 nm 8 nm
• 插座
  N/A N/A
• 发布日期
  Q4/2015 Q4/2020
• Part Number
  -- SM6350