Intel Core i3-10100F 对 Intel Xeon Gold 5122. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Desktop / Server Desktop / Server
• 系列
  Intel Core i3 Intel Xeon Gold
• 一代人
  10 1
• CPU组
  Intel Core i 10000 Intel Xeon Gold 5100/6100
• 过去的模式
  Intel Core i3-9100F --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  3.60 GHz 3.60 GHz
• CPU核数
  4 4
• 涡轮增压 (1核)
  4.30 GHz 3.70 GHz
• CPU线程
  8 8
• Turbo (4 Cores)
  4.10 GHz 3.70 GHz
• 超线程
  是 是
• 超频
  没有 没有
• 核心架构
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  没有iGPU 没有iGPU
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  没有 没有
• VP9
  没有 没有
• VP8
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 没有
• JPEG
  没有 没有

Overview of the types and quantities of RAM supported by Intel Xeon Gold 5122 和 Intel Core i3-10100F. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  DDR4-2666 DDR4-2666
• 最大内存
  128 GB
• ECC
  没有 是
• 记忆通道
  2 6
• PCIe版本
  3.0 3.0
• PCIe通道
  16 48

• AES-NI
  是 是

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-10100F 和 Intel Xeon Gold 5122 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W 105 W
• 最高温度
  100 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-10100F 和 Intel Xeon Gold 5122, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  x86-64 (64 bit) x86-64 (64 bit)
• 虚拟化
  VT-x, VT-x EPT, VT-d VT-x, VT-x EPT, VT-d
• ISA扩展
  SSE4.1, SSE4.2, AVX2 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  6.00 MB 17.00 MB
• 建筑学
  Comet Lake S Skylake
• 技术过程
  14 nm 14 nm
• 插座
  LGA 1200 LGA 3647
• 发布日期
  Q4/2020 Q3/2017