MediaTek Dimensity 820 对 MediaTek Helio G25. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Mediatek Dimensity Mediatek Helio
• 一代人
  1 1
• CPU组
  MediaTek Dimensity 820 MediaTek Helio G25/G35

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A76 4x Cortex-A53
• B core
  4x Cortex-A55 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G57 MP5 PowerVR GE8320
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  5 1
• 着色器
  80 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• 一代人
  Vallhall 1 --
• DirectX Version
  12 10
• 技术过程
  7 nm 20 nm
• 发布日期
  Q2/2020 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 没有
• h265 / HEVC (10 bit)
  Decode / Encode 没有
• h264
  Decode / Encode 没有
• VP9
  Decode / Encode 没有
• VP8
  Decode / Encode 没有
• AV1
  Decode 没有
• AVC
  Decode / Encode 没有
• VC-1
  Decode / Encode 没有
• JPEG
  Decode / Encode 没有

Overview of the types and quantities of RAM supported by MediaTek Helio G25 和 MediaTek Dimensity 820. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1600
• 最大内存
  16 GB 6 GB
• ECC
  没有 没有
• 记忆通道
  2 1
• PCIe版本
  --
• PCIe通道
  --

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 820 和 MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 820 和 MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• ISA扩展
  --
• 建筑学
  Cortex-A76 / Cortex-A55 Cortex-A53 / Cortex-A53
• 技术过程
  7 nm 12 nm
• 插座
  N/A N/A
• 发布日期
  Q2/2020 Q2/2020
• Part Number
  MT6875 MT6762G