Qualcomm Snapdragon 7c Plus Gen 3 对 Intel Core i5-12600K. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Intel Core i5
• CPU组
  Qualcomm Snapdragon 7c Plus Intel Core i 12000
• 分段
  Mobile Desktop / Server
• 一代人
  3 12
• 过去的模式
  Qualcomm Snapdragon 7c Gen 2 Intel Core i5-11600K

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 超频
  没有 是

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  不详 Intel Iris Xe Graphics 32 (Alder Lake S)
• GPU frequency
  0.70 GHz 0.40 GHz
• GPU (Turbo)
  没有涡轮增压 1.45 GHz
• 执行单位
  0 32
• 着色器
  0 256
• Max. GPU Memory
  -- 16 GB
• Max. displays
  0 4
• 一代人
  12
• 技术过程
  10 nm
• 发布日期
  Q4/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 Decode / Encode
• h265 / HEVC (10 bit)
  没有 Decode / Encode
• h264
  没有 Decode / Encode
• VP8
  没有 Decode
• VP9
  没有 Decode / Encode
• AV1
  没有 Decode
• AVC
  没有 Decode / Encode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Intel Core i5-12600K 和 Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266LPDDR5-6400 DDR4-3200DDR5-4800
• 最大内存
  256 GB
• 记忆通道
  2 2
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 和 Intel Core i5-12600K to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  125 W
• TDP (PL2)
  -- 228 W / 56 s
• 最高温度
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 和 Intel Core i5-12600K, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4.1, SSE4.2, AVX2, AVX2+
• L2-Cache
  -- 20.00 MB
• 建筑学
  Cortex-A78 / Cortex-A55 Alder Lake S
• 技术过程
  6 nm 10 nm
• 虚拟化
  None VT-x, VT-x EPT, VT-d
• 插座
  N/A LGA 1700
• 发布日期
  Q1/2022 Q4/2021
• Part Number
  -- BX8071512600K