UNISOC T606 vs Qualcomm Snapdragon 410 LTE. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  UNISOC 4G Qualcomm Snapdragon
• CPU group
  UNISOC 4G 12nm Qualcomm Snapdragon 410
• Segment
  Mobile Mobile
• Generation
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 4 / 4
• Core architecture
  hybrid (big.LITTLE) normal
• A-Core
  2x Cortex-A75 --
• B-Core
  6x Cortex-A55 --
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP1 Qualcomm Adreno 306
• GPU frequency
  0.65 GHz 0.40 GHz
• GPU (Turbo)
  No turbo 0.40 GHz
• Execution units
  2 0
• Shader
  32 24
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 3
• Direct X
  12 11
• Technology
  7 nm 28 nm
• Release date
  Q2/2020 Q3/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 410 LTE and UNISOC T606. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1600 LPDDR2-533LPDDR3-533
• Memory channels
  0 1
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T606 and Qualcomm Snapdragon 410 LTE to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T606 and Qualcomm Snapdragon 410 LTE, including virtual machine technologies and fabrication processes.

• Technology
  12 nm 28 nm
• Socket
  -- N/A
• Architecture
  Cortex-A53
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q3/2021 2014
• Part Number
  -- MSM8916