UNISOC T606 対 Qualcomm Snapdragon 410 LTE. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  UNISOC 4G Qualcomm Snapdragon
• CPUグループ
  UNISOC 4G 12nm Qualcomm Snapdragon 410
• セグメント
  Mobile Mobile
• 世代
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 4 / 4
• コア・アーキテクチャ
  hybrid (big.LITTLE) normal
• A-Core
  2x Cortex-A75 --
• B-Core
  6x Cortex-A55 --
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G57 MP1 Qualcomm Adreno 306
• GPU frequency
  0.65 GHz 0.40 GHz
• GPU (Turbo)
  ターボなし 0.40 GHz
• 実行部隊
  2 0
• シェーダー
  32 24
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• 世代
  Vallhall 1 3
• Direct X
  12 11
• ぎじゅつてきなかだい
  7 nm 28 nm
• 発売日
  Q2/2020 Q3/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode いいえ
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode いいえ
• VP9
  Decode / Encode いいえ
• AV1
  Decode いいえ
• AVC
  Decode / Encode いいえ
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 410 LTE と UNISOC T606. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1600 LPDDR2-533LPDDR3-533
• メモリーチャンネル
  0 1
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of UNISOC T606 と Qualcomm Snapdragon 410 LTE to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T606 と Qualcomm Snapdragon 410 LTE, including virtual machine technologies and fabrication processes.

• ぎじゅつてきなかだい
  12 nm 28 nm
• ソケット
  -- N/A
• 建築
  Cortex-A53
• 仮想化
  None None
• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 発売日
  Q3/2021 2014
• Part Number
  -- MSM8916