UNISOC T606 versus Qualcomm Snapdragon 410 LTE. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  UNISOC 4G Qualcomm Snapdragon
• Grupo CPU
  UNISOC 4G 12nm Qualcomm Snapdragon 410
• Segmento
  Mobile Mobile
• Geração
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 4 / 4
• Arquitectura central
  hybrid (big.LITTLE) normal
• A-Core
  2x Cortex-A75 --
• B-Core
  6x Cortex-A55 --
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G57 MP1 Qualcomm Adreno 306
• GPU frequency
  0.65 GHz 0.40 GHz
• GPU (Turbo)
  Sem turbo 0.40 GHz
• Unidades de execução
  2 0
• Shader
  32 24
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Geração
  Vallhall 1 3
• Direct X
  12 11
• Processo técnico
  7 nm 28 nm
• Data de lançamento
  Q2/2020 Q3/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Não
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Não
• VP9
  Decode / Encode Não
• AV1
  Decode Não
• AVC
  Decode / Encode Não
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 410 LTE e UNISOC T606. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-1600 LPDDR2-533LPDDR3-533
• Canais de memória
  0 1
• ECC
  Não Não
• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of UNISOC T606 e Qualcomm Snapdragon 410 LTE to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T606 e Qualcomm Snapdragon 410 LTE, including virtual machine technologies and fabrication processes.

• Processo técnico
  12 nm 28 nm
• Socket
  -- N/A
• Arquitectura
  Cortex-A53
• Virtualização
  None None
• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Data de lançamento
  Q3/2021 2014
• Part Number
  -- MSM8916