AMD Ryzen Embedded V3C16
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Q3/2022
AMD Ryzen Embedded V3C16

Prozessor AMD Ryzen Embedded V3C16, Spezifikationen und Benchmarks

Der AMD Ryzen Embedded V3C16 Prozessor wird in FP7r2 Sockel-Platinen installiert und arbeitet mit einer Frequenz von 2.00 GHz. Der AMD Ryzen Embedded V3C16 hat insgesamt 6 / 12 Kerne. Erscheinungsdatum: Q3/2022. TDP beträgt 15 W. Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum AMD Ryzen Embedded V3C16 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf AMD Ryzen Embedded V3C16 laufen.

AMD Ryzen Embedded V3C16 Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Serie
  • CPU Gruppe
    AMD Ryzen Embedded V3000
  • Segment
    Desktop / Server
  • Generation
    3
  • Vergangenes Modell
    AMD Ryzen Embedded V2516
  • Successor
    --
CPU Technical Specs

AMD Ryzen Embedded V3C16. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • CPU Cores / Threads
    6 / 12
  • Zentrale Architektur
    normal
  • Kerne
    6x Zen 3
  • Hyperthreading / SMT
    Ja
  • Übertaktung
    Nein
  • Frequenz
    2.00 GHz
  • Turbo Frequency (1 Core)
    3.80 GHz
  • Turbo Frequency (6 Cores)
    3.00 GHz
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    keine iGPU
  • GPU frequency
  • GPU (Turbo)
    kein Turbo
  • Ausführungseinheiten
  • Shader
  • Max. GPU Memory
    --
  • Max. displays
  • Generation
  • Direct X
    --
  • technisches verfahren
  • Datum der Veröffentlichung
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Nein
  • h265 / HEVC (10 bit)
    Nein
  • h264
    Nein
  • VP8
    Nein
  • VP9
    Nein
  • AV1
    Nein
  • AVC
    Nein
  • VC-1
    Nein
  • JPEG
    Nein
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    DDR5-4800
  • Max. Speicher
    64 GB
  • Speicherkanäle
    2 (Dual Channel)
  • Bandwidth
    76.8 GB/s
  • ECC
    Ja
  • PCIe
    4.0 x 20
  • AES-NI
    Ja
Energieverbrauch
  • TDP (PL1)
    15 W
  • TDP (PL2)
    --
  • TDP up
    25 W
  • TDP down
    10 W
  • Maximale Temperatur
    105 °C
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • technisches verfahren
    6 nm
  • Chip design
    Chiplet
  • Steckdose
    FP7r2
  • L2-Cache
    3.00 MB
  • L3-Cache
    16.00 MB
  • Architektur
    Rembrandt (Zen 3+)
  • Operating systems
    Windows 10, Windows 11, Linux
  • Virtualisierung
    AMD-V, SVM
  • Befehlssatz (ISA)
    x86-64 (64 bit)
  • ISA-Erweiterungen
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • Datum der Veröffentlichung
    Q3/2022
  • Release price
    --
  • Part Number
    --
  • Spezifikation
    Technical data sheet
Positionen in allen Ranglisten

Gemeinsame Standpunkte AMD Ryzen Embedded V3C16 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

No data

AMD Ryzen Embedded V3C16 Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of AMD Ryzen Embedded V3C16 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

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*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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AMD Ryzen Embedded V3C16

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