AMD C-50 gegen AMD E-300. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  AMD C AMD E
• Generation
  1 1
• CPU Gruppe
  AMD C AMD E/E1/E2-1000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.00 GHz 1.30 GHz
• CPU Kerne
  2 2
• Turbo (1 Kern)
  kein Turbo kein Turbo
• CPU Threads
  2 2
• Turbo (2 Cores)
  kein Turbo kein Turbo
• Hyperthreading
  Nein Nein
• Übertaktung
  Ja Nein
• Zentrale Architektur
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  AMD Radeon HD 6250 AMD Radeon HD 6310
• GPU frequency
  0.28 GHz 0.49 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  1 1
• Shader
  80 80
• Max. GPU Memory
  1 GB 1 GB
• Max. displays
  2 2
• Generation
  3 3
• DirectX Version
  11 11
• technisches verfahren
  40 nm 40 nm
• Datum der Veröffentlichung
  Q4/2010 Q4/2010

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode Decode
• VP9
  Nein Nein
• VP8
  Nein Nein
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD E-300 und AMD C-50. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR3-1066 DDR3-1066
• ECC
  Nein Nein
• Speicherkanäle
  1 1

• AES-NI
  Nein Ja

Analyze the TDP (Thermal Design Power) requirements of AMD C-50 und AMD E-300 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 18 W

Information on architecture, interfaces, and additional instructions supported by AMD C-50 und AMD E-300, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualisierung
  AMD-V AMD-V
• ISA-Erweiterungen
  SSE3, SSE4a SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  1.00 MB 1.00 MB
• Architektur
  Ontario (Bobcat) Zacate (Bobcat)
• technisches verfahren
  40 nm 32 nm
• Steckdose
  BGA 413 BGA 413
• Datum der Veröffentlichung
  Q1/2011 Q3/2011