AMD Ryzen Embedded V3C14 gegen AMD EPYC 9274F. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  AMD Ryzen Embedded V AMD EPYC
• CPU Gruppe
  AMD Ryzen Embedded V3000 AMD EPYC 9004
• Segment
  Desktop / Server Desktop / Server
• Generation
  3 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 8 24 / 48
• Zentrale Architektur
  normal normal
• Kerne
  4x Zen 3 24x Zen 4
• Hyperthreading / SMT
  Ja Ja
• Übertaktung
  Nein Nein
• Frequenz
  2.30 GHz 4.05 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 4.30 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  keine iGPU keine iGPU
• GPU (Turbo)
  kein Turbo kein Turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Nein Nein
• VP8
  Nein Nein
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Nein
• JPEG
  Nein Nein

Overview of the types and quantities of RAM supported by AMD EPYC 9274F und AMD Ryzen Embedded V3C14. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR5-4800 DDR5-4800
• Max. Speicher
  64 GB 6144 GB
• Speicherkanäle
  2 (Dual Channel) 12
• Bandwidth
  76.8 GB/s 461.0 GB/s
• ECC
  Ja Ja
• PCIe
  4.0 x 20 5.0 x 128
• AES-NI
  Ja Ja

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V3C14 und AMD EPYC 9274F to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 320 W
• TDP up
  25 W 400 W
• TDP down
  10 W --
• Maximale Temperatur
  105 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V3C14 und AMD EPYC 9274F, including virtual machine technologies and fabrication processes.

• technisches verfahren
  6 nm 5 nm
• Chip design
  Chiplet Chiplet
• Steckdose
  FP7r2 SP5
• L2-Cache
  2.00 MB 24.00 MB
• L3-Cache
  8.00 MB 256.00 MB
• Architektur
  Rembrandt (Zen 3+) Genoa (Zen 4)
• Operating systems
  Windows 10, Windows 11, Linux Windows Server 2022, Linux, Windows 11
• Virtualisierung
  AMD-V, SVM AMD-V, SVM
• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA-Erweiterungen
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI
• Datum der Veröffentlichung
  Q3/2022 Q4/2022
• Release price
  -- 3060 $
• Part Number
  -- 100-000000794
• Spezifikation
  Technical data sheet Technical data sheet