HiSilicon Kirin 650 gegen HiSilicon Kirin 655. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generation
  4 4
• CPU Gruppe
  HiSilicon Kirin 650 HiSilicon Kirin 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.70 GHz 1.70 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.00 GHz 2.12 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 2.12 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Cortex-A53
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-T830 MP2 ARM Mali-T830 MP2
• GPU frequency
  0.90 GHz 0.90 GHz
• GPU (Turbo)
  0.90 GHz 0.90 GHz
• Ausführungseinheiten
  2 2
• Shader
  32 32
• Max. displays
  2 2
• Generation
  Midgard 4 Midgard 4
• DirectX Version
  11 11
• technisches verfahren
  28nm 28nm
• Datum der Veröffentlichung
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Nein Nein
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Nein
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 655 und HiSilicon Kirin 650. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933 LPDDR3-933
• ECC
  Nein Nein
• Speicherkanäle
  2 2

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 650 und HiSilicon Kirin 655 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 650 und HiSilicon Kirin 655, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Cortex-A53 / Cortex-A53 Cortex-A53 / Cortex-A53
• technisches verfahren
  16 nm 16 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2016 Q2/2016