HiSilicon Kirin 9000 gegen AMD Ryzen 9 6900HX. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin AMD Ryzen
• Generation
  9 5
• CPU Gruppe
  HiSilicon Kirin 9000 AMD Ryzen 6000H
• Vergangenes Modell
  -- AMD Ryzen 9 5900HX

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  2.05 GHz 3.30 GHz
• Turbo (1 Kern)
  3.13 GHz 4.90 GHz
• Turbo (8 Cores)
  2.54 GHz 4.20 GHz
• Hyperthreading
  Nein Ja
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G78 MP24 AMD Radeon RX 680M
• GPU frequency
  0.76 GHz 2.40 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  24 12
• Shader
  384 768
• Max. GPU Memory
  -- 8 GB
• Max. displays
  1 3
• Generation
  Vallhall 2 9
• technisches verfahren
  5 nm 6 nm
• Datum der Veröffentlichung
  Q4/2020 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Ryzen 9 6900HX und HiSilicon Kirin 9000. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133LPDDR5-2750 DDR5-4800LPDDR5-6400
• Max. Speicher
  64 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 9000 und AMD Ryzen 9 6900HX to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W
• TDP up
  -- 54 W
• Maximale Temperatur
  -- 105 °C

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 9000 und AMD Ryzen 9 6900HX, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualisierung
  None AMD-V, SVM
• ISA-Erweiterungen
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  -- 4.00 MB
• L3-Cache
  -- 16.00 MB
• Architektur
  Cortex-A77 / Cortex-A55 Rembrandt (Zen 3+)
• technisches verfahren
  5 nm 6 nm
• Steckdose
  N/A FP7
• Datum der Veröffentlichung
  Q4/2020 Q1/2022