Intel Core i3-2350M gegen Intel Core i3-2367M. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Intel Core i3 Intel Core i3
• Generation
  2 2
• CPU Gruppe
  Intel Core i 2000M Intel Core i 2000M

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  2.30 GHz 1.40 GHz
• CPU Kerne
  2 2
• Turbo (1 Kern)
  kein Turbo kein Turbo
• CPU Threads
  4 4
• Turbo (2 Cores)
  kein Turbo kein Turbo
• Hyperthreading
  Ja Ja
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Intel HD Graphics 3000 Intel HD Graphics 3000
• GPU frequency
  0.65 GHz 0.35 GHz
• GPU (Turbo)
  1.15 GHz 1.00 GHz
• Ausführungseinheiten
  12 12
• Shader
  96 96
• Max. displays
  2 2
• Generation
  6 6
• DirectX Version
  10.1 10.1
• technisches verfahren
  32 nm 32 nm
• Datum der Veröffentlichung
  Q1/2011 Q1/2011

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode / Encode Decode / Encode
• VP9
  Nein Nein
• VP8
  Nein Nein
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Nein Nein

Overview of the types and quantities of RAM supported by Intel Core i3-2367M und Intel Core i3-2350M. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR3-1066DDR3-1333 DDR3-1066DDR3-1333
• Max. Speicher
  16 GB
• ECC
  Nein Ja
• Speicherkanäle
  2 2
• PCIe-Version
  2.0 2.0
• PCIe-Lanes
  16 16

• AES-NI
  Ja Ja

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-2350M und Intel Core i3-2367M to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  35 W 17 W
• Maximale Temperatur
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-2350M und Intel Core i3-2367M, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualisierung
  VT-x, VT-x EPT VT-x, VT-x EPT
• ISA-Erweiterungen
  SSE4.1, SSE4.2, AVX SSE4.1, SSE4.2, AVX
• L3-Cache
  3.00 MB 3.00 MB
• Architektur
  Sandy Bridge H Sandy Bridge H
• technisches verfahren
  32 nm 32 nm
• Steckdose
  PPGA 988 BGA 1023
• Datum der Veröffentlichung
  Q4/2011 Q4/2011