MediaTek Helio P35 gegen HiSilicon Kirin 710. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio HiSilicon Kirin
• CPU Gruppe
  MediaTek Helio P22/P35 HiSilicon Kirin 710
• Segment
  Mobile Mobile
• Generation
  3 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR GE8320 ARM Mali-G51 MP4
• GPU frequency
  0.68 GHz 0.65 GHz
• GPU (Turbo)
  kein Turbo 1.00 GHz
• Ausführungseinheiten
  1 8
• Shader
  0 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Bifrost 1
• technisches verfahren
  20 nm 12 nm
• Datum der Veröffentlichung
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode / Encode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 und MediaTek Helio P35. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933LPDDR4-1600 LPDDR3LPDDR4
• Max. Speicher
  6 GB 6 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P35 und HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P35 und HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 1.00 MB
• Architektur
  Cortex-A53 Cortex-A73 / Cortex-A53
• technisches verfahren
  12 nm 12 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2019 Q3/2018
• Part Number
  MT6765 --