Qualcomm Snapdragon 850 gegen Qualcomm Snapdragon 429. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  5 4
• CPU Gruppe
  Qualcomm Snapdragon 845 Qualcomm Snapdragon 429

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.95 GHz
• CPU Kerne
  8 4
• Turbo (1 Kern)
  2.95 GHz 1.95 GHz
• CPU Threads
  8 4
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 385 Gold --
• B core
  4x Kryo 385 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 630 Qualcomm Adreno 504
• GPU frequency
  0.70 GHz 0.50 GHz
• GPU (Turbo)
  kein Turbo 0.50 GHz
• Shader
  256 0
• Max. GPU Memory
  8 GB --
• Max. displays
  2 0
• Generation
  4 5
• DirectX Version
  11 11
• technisches verfahren
  10 nm 12 nm
• Datum der Veröffentlichung
  Q1/2018 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Nein
• VP8
  Decode Nein
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 429 und Qualcomm Snapdragon 850. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR3
• Max. Speicher
  8 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 1

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 850 und Qualcomm Snapdragon 429 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 850 und Qualcomm Snapdragon 429, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Kryo 385 Cortex-A53
• technisches verfahren
  10 nm 12 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2018 Q3/2018
• Part Number
  SDM850 SDM429