Qualcomm Snapdragon 865 Plus gegen Qualcomm Snapdragon 870. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 865/870 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Generation
  7 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 650 Qualcomm Adreno 650
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.67 GHz 0.67 GHz
• Ausführungseinheiten
  2 2
• Shader
  512 512
• Max. displays
  1 1
• Generation
  6 6
• technisches verfahren
  7 nm 7 nm
• Datum der Veröffentlichung
  Q4/2019 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 und Qualcomm Snapdragon 865 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266LPDDR5-5500 LPDDR4X-4266LPDDR5-5500
• Max. Speicher
  16 GB 16 GB
• Speicherkanäle
  4 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 865 Plus und Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 865 Plus und Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L3-Cache
  3.00 MB 3.00 MB
• Architektur
  Kryo 585 Kryo 585
• technisches verfahren
  7 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2020 Q2/2021
• Part Number
  SM8250-AB SM8250-AC