Qualcomm Snapdragon 8c gegen Apple M1 (7-GPU). Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Apple M series
• CPU Gruppe
  Qualcomm Snapdragon 8c Apple M1
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Kryo 490 Gold 4x Firestorm
• B-Core
  4x Kryo 490 Silver 4x Icestorm
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 675 Apple M1 (7 Core)
• GPU frequency
  0.25 GHz 1.30 GHz
• GPU (Turbo)
  0.59 GHz kein Turbo
• Ausführungseinheiten
  7 112
• Shader
  672 896
• Max. GPU Memory
  4 GB 8 GB
• Max. displays
  1 2
• Generation
  5 1
• Direct X
  12.0 --
• technisches verfahren
  7 nm 5 nm
• Datum der Veröffentlichung
  Q4/2018 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 (7-GPU) und Qualcomm Snapdragon 8c. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266 LPDDR4X-4266
• Max. Speicher
  16 GB 16 GB
• Speicherkanäle
  4 2 (Dual Channel)
• ECC
  Nein Nein
• PCIe
  4.0
• AES-NI
  Nein Ja

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 8c und Apple M1 (7-GPU) to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 8c und Apple M1 (7-GPU), including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  Rosetta 2 x86-Emulation
• L2-Cache
  2.00 MB 16.00 MB
• L3-Cache
  3.00 MB --
• Architektur
  Kryo 490 M1
• technisches verfahren
  7 nm 5 nm
• Virtualisierung
  None Apple Virtualization Framework
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2019 Q4/2020
• Part Number
  -- APL 1102