HiSilicon Kirin 930
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Q1/2015
HiSilicon Kirin 930

Prozessor HiSilicon Kirin 930, Spezifikationen und Benchmarks

Der HiSilicon Kirin 930 Prozessor wird in N/A Sockel-Platinen installiert und arbeitet mit einer Frequenz von 1.50 GHz. Der HiSilicon Kirin 930 hat insgesamt 8 Kerne. Erscheinungsdatum: Q1/2015. TDP beträgt . Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum HiSilicon Kirin 930 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf HiSilicon Kirin 930 laufen.

HiSilicon Kirin 930 Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Serie
  • Generation
    3
  • CPU Gruppe
    HiSilicon Kirin 930
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 930. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequenz
    1.50 GHz
  • CPU Kerne
    8
  • Turbo (1 Kern)
    2.00 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.00 GHz
  • Hyperthreading
    Nein
  • Übertaktung
    Nein
  • Zentrale Architektur
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A53
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    ARM Mali-T628 MP4
  • GPU frequency
    0.60 GHz
  • GPU (Turbo)
    0.60 GHz
  • Ausführungseinheiten
    4
  • Shader
    64
  • Max. GPU Memory
    --
  • Max. displays
    1
  • Generation
    Midgard 2
  • DirectX Version
    11
  • technisches verfahren
    32nm
  • Datum der Veröffentlichung
    Q4/2012
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Nein
  • h265 / HEVC (10 bit)
    Nein
  • h264
    Decode / Encode
  • VP9
    Nein
  • VP8
    Decode / Encode
  • AV1
    Nein
  • AVC
    Nein
  • VC-1
    Nein
  • JPEG
    Nein
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    LPDDR3-1600
  • Max. Speicher
  • ECC
    Nein
  • Speicherkanäle
    2
  • PCIe-Version
  • PCIe-Lanes
Verschlüsselung

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Nein
Energieverbrauch
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Maximale Temperatur
    --
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    ARMv8-A64 (64 bit)
  • Virtualisierung
    None
  • ISA-Erweiterungen
  • L2-Cache
    --
  • L3-Cache
    --
  • Architektur
    Cortex-A53 / Cortex-A53
  • technisches verfahren
    28 nm
  • Steckdose
    N/A
  • Datum der Veröffentlichung
    Q1/2015
  • Part Number
    --
Positionen in allen Ranglisten

Gemeinsame Standpunkte HiSilicon Kirin 930 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1623 place

HiSilicon Kirin 930 Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of HiSilicon Kirin 930 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
Die Leistung der iGPU - der internen GPU in Spielen.
77
77
77
77
HiSilicon Kirin 930

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit HiSilicon Kirin 930.

AMD A4-5000 Siehe
AMD A6-3420M Siehe
AMD A8-3500M Siehe
AMD E2-6110 Siehe
AMD E-240 Siehe
AMD G-T52R Siehe
Apple A8X Siehe
HiSilicon Kirin 930 Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 930

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