HiSilicon Kirin 955
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Q2/2016
HiSilicon Kirin 955

Prozessor HiSilicon Kirin 955, Spezifikationen und Benchmarks

1809 Platz in der Gesamtwertung CPUs!
Der HiSilicon Kirin 955 Prozessor wird in N/A Sockel-Platinen installiert und arbeitet mit einer Frequenz von 1.80 GHz. Der HiSilicon Kirin 955 hat insgesamt 8 Kerne. Erscheinungsdatum: Q2/2016. TDP beträgt . Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum HiSilicon Kirin 955 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf HiSilicon Kirin 955 laufen.

HiSilicon Kirin 955 Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Serie
  • Generation
    4
  • CPU Gruppe
    HiSilicon Kirin 950
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 955. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequenz
    1.80 GHz
  • CPU Kerne
    8
  • Turbo (1 Kern)
    2.50 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.50 GHz
  • Hyperthreading
    Nein
  • Übertaktung
    Nein
  • Zentrale Architektur
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A72
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    ARM Mali-T880 MP4
  • GPU frequency
    0.90 GHz
  • GPU (Turbo)
    0.90 GHz
  • Ausführungseinheiten
    4
  • Shader
    64
  • Max. GPU Memory
    --
  • Max. displays
    2
  • Generation
    Midgard 4
  • DirectX Version
    11
  • technisches verfahren
    16 nm
  • Datum der Veröffentlichung
    Q2/2016
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode
  • h264
    Decode / Encode
  • VP9
    Nein
  • VP8
    Decode / Encode
  • AV1
    Nein
  • AVC
    Nein
  • VC-1
    Nein
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    LPDDR3LPDDR4
  • Max. Speicher
  • ECC
    Nein
  • Speicherkanäle
    2
  • PCIe-Version
  • PCIe-Lanes
Verschlüsselung

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Nein
Energieverbrauch
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Maximale Temperatur
    --
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    ARMv8-A64 (64 bit)
  • Virtualisierung
    None
  • ISA-Erweiterungen
  • L2-Cache
    --
  • L3-Cache
    --
  • Architektur
    Cortex-A72 / Cortex-A53
  • technisches verfahren
    16 nm
  • Steckdose
    N/A
  • Datum der Veröffentlichung
    Q2/2016
  • Part Number
    --
Positionen in allen Ranglisten

Gemeinsame Standpunkte HiSilicon Kirin 955 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • Geekbench 5, 64bit (Single-Core)
    1326 place
  • Geekbench 5, 64bit (Multi-Core)
    1318 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1501 place

HiSilicon Kirin 955 Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of HiSilicon Kirin 955 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC ist ein beliebter plattformübergreifender Leistungstest für Desktop- oder Mobilprozessoren, der den Systemspeicher intensiv nutzt.
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC ist ein beliebter plattformübergreifender Leistungstest für Desktop- oder Mobilprozessoren, der den Systemspeicher intensiv nutzt.
998
998
995
989
HiSilicon Kirin 955
iGPU - FP32 Performance (Single-precision GFLOPS)
Die Leistung der iGPU - der internen GPU in Spielen.
125
125
122
122
HiSilicon Kirin 955

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit HiSilicon Kirin 955.

Qualcomm Snapdragon 630 Siehe
Qualcomm Snapdragon 650 Siehe
Samsung Exynos 5433 Siehe
Qualcomm Snapdragon 626 Siehe
HiSilicon Kirin 950 Siehe
Intel Core2 Duo E7200 Siehe
MediaTek Helio P95 Siehe
MediaTek Helio P60 Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 955

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