MediaTek Helio P10 vs Qualcomm Snapdragon 617. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Helio Qualcomm Snapdragon
• CPU group
  MediaTek Helio P10 Qualcomm Snapdragon 610
• Segment
  Mobile Mobile
• Generation
  1 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A53 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-T860 MP2 Qualcomm Adreno 405
• GPU frequency
  0.70 GHz 0.55 GHz
• GPU (Turbo)
  0.70 GHz 0.55 GHz
• Execution units
  2 0
• Shader
  32 48
• Max. displays
  2 0
• Generation
  Midgard 4 4
• Direct X
  11 11
• Technology
  28nm 28 nm
• Release date
  Q4/2015 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 and MediaTek Helio P10. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3-933 LPDDR3-933
• Max. Memory
  4 GB
• Memory channels
  1 1
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P10 and Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P10 and Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A53 Cortex-A53
• Technology
  28 nm 28 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2015 Q4/2015
• Part Number
  MT6755 MSM8952