MediaTek Helio P10 versus Qualcomm Snapdragon 617. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Helio Qualcomm Snapdragon
• Grupo CPU
  MediaTek Helio P10 Qualcomm Snapdragon 610
• Segmento
  Mobile Mobile
• Geração
  1 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A53 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-T860 MP2 Qualcomm Adreno 405
• GPU frequency
  0.70 GHz 0.55 GHz
• GPU (Turbo)
  0.70 GHz 0.55 GHz
• Unidades de execução
  2 0
• Shader
  32 48
• Max. displays
  2 0
• Geração
  Midgard 4 4
• Direct X
  11 11
• Processo técnico
  28nm 28 nm
• Data de lançamento
  Q4/2015 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Não
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Não
• VP9
  Não Não
• AV1
  Não Não
• AVC
  Não Não
• VC-1
  Não Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 e MediaTek Helio P10. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3-933 LPDDR3-933
• Máx. Memória
  4 GB
• Canais de memória
  1 1
• ECC
  Não Não
• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P10 e Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P10 e Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Arquitectura
  Cortex-A53 Cortex-A53
• Processo técnico
  28 nm 28 nm
• Virtualização
  None None
• Socket
  N/A N/A
• Data de lançamento
  Q4/2015 Q4/2015
• Part Number
  MT6755 MSM8952