HiSilicon Kirin 655 contra Qualcomm Snapdragon 650. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generación
  4 4
• Grupo CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.70 GHz 1.40 GHz
• Núcleos de CPU
  8 6
• Turbo (1 núcleo)
  2.12 GHz 1.80 GHz
• Hilos de la CPU
  8 6
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A72
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-T830 MP2 Qualcomm Adreno 510
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Unidades de ejecución
  2 0
• Shader
  32 128
• Max. displays
  2 0
• Generación
  Midgard 4 5
• DirectX Version
  11 11
• Proceso técnico
  28nm 14 nm
• Fecha de publicación
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode
• VP9
  No Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 650 y HiSilicon Kirin 655. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-933 LPDDR3-933
• ECC
  No No
• Canales de memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 655 y Qualcomm Snapdragon 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 655 y Qualcomm Snapdragon 650, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A53 / Cortex-A53 Cortex-A72 / Cortex-A53
• Proceso técnico
  16 nm 28 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q2/2016 Q1/2016
• Part Number
  -- MSM8956