HiSilicon Kirin 655 versus Qualcomm Snapdragon 650. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Geração
  4 4
• Grupo CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.70 GHz 1.40 GHz
• Núcleos de CPU
  8 6
• Turbo (1 núcleo)
  2.12 GHz 1.80 GHz
• Roscas de CPU
  8 6
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A72
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-T830 MP2 Qualcomm Adreno 510
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Unidades de execução
  2 0
• Shader
  32 128
• Max. displays
  2 0
• Geração
  Midgard 4 5
• DirectX Version
  11 11
• Processo técnico
  28nm 14 nm
• Data de lançamento
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Não
• h264
  Decode / Encode Decode
• VP9
  Não Decode
• VP8
  Decode / Encode Decode
• AV1
  Não Não
• AVC
  Não Não
• VC-1
  Não Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 650 e HiSilicon Kirin 655. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3-933 LPDDR3-933
• ECC
  Não Não
• Canais de memória
  2 2

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 655 e Qualcomm Snapdragon 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 655 e Qualcomm Snapdragon 650, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Arquitectura
  Cortex-A53 / Cortex-A53 Cortex-A72 / Cortex-A53
• Processo técnico
  16 nm 28 nm
• Socket
  N/A N/A
• Data de lançamento
  Q2/2016 Q1/2016
• Part Number
  -- MSM8956