AMD Ryzen Embedded R2312
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Q2/2022
AMD Ryzen Embedded R2312

Processeur AMD Ryzen Embedded R2312, spécifications et caractéristiques de référence

Le processeur AMD Ryzen Embedded R2312 est installé sur des cartes avec un socket FP5 et fonctionne à une fréquence de 2.70 GHz. Le AMD Ryzen Embedded R2312 compte un total de 2 / 4 cœurs. Date de sortie : Q2/2022. Le TDP est de 15 W. Cet aperçu vous donnera toutes les spécifications techniques et des données détaillées sur le processeur AMD Ryzen Embedded R2312. Découvrez tout pour savoir si un jeu ou un logiciel fonctionnera sur le AMD Ryzen Embedded R2312.

Spécifications

Données techniques
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Série
  • Groupe de CPU
    AMD Ryzen Embedded R2000
  • Segment
    Desktop / Server
  • Génération
    2
  • Modèle précédent
    --
  • Successor
    --
CPU Technical Specs

AMD Ryzen Embedded R2312. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • CPU Cores / Threads
    2 / 4
  • Architecture de base
    normal
  • Cœurs
    4x
  • Hyperthreading / SMT
    Oui
  • Overclocking
    Non
  • Fréquence
    2.70 GHz
  • Turbo Frequency (1 Core)
    3.50 GHz
  • Turbo Frequency (2 Cores)
    3.10 GHz
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nom du GPU
    AMD Radeon Vega 3 Graphics
  • GPU frequency
    1.20 GHz
  • GPU (Turbo)
    Pas de turbo
  • Unités d'exécution
    3
  • Shader
    192
  • Max. GPU Memory
    2 GB
  • Max. displays
    3
  • Génération
    8
  • Direct X
    12
  • Processus technologique
    14 nm
  • Date de sortie
    Q1/2018
Prise en charge des codecs matériels

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    Non
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Type de mémoire
    DDR4-2400
  • Max. Mémoire
    32 GB
  • Canaux de mémoire
    2
  • Bandwidth
    38.4 GB/s
  • ECC
    Oui
  • PCIe
    3.0 x 8
  • AES-NI
    Oui
Consommation d'énergie
  • TDP (PL1)
    15 W
  • TDP (PL2)
    --
  • TDP up
    25 W
  • TDP down
    12 W
  • Température maximale
    105 °C
* voir ci-dessous
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Jeu d'instructions (ISA)
    x86-64 (64 bit)
  • Extensions ISA
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • L2-Cache
    1.00 MB
  • L3-Cache
    2.00 MB
  • Architecture
    Zen+
  • spécification
    --
  • Processus technologique
    12 nm
  • Virtualization
    AMD-V, SVM
  • Socket
    FP5
  • Date de sortie
    Q2/2022
  • Part Number
    --
Positions dans tous les classements

Positions communes AMD Ryzen Embedded R2312 CPU dans des benchmarks populaires, pour comparaison avec d'autres modèles.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    698 place

Benchmarks

Tests de performance CPU

Compare the benchmark scores of AMD Ryzen Embedded R2312 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
Les performances de l'iGPU - le GPU interne dans les jeux.
480
476
476
461
AMD Ryzen Embedded R2312

Synonymes

Processeurs similaires en termes de performances.

Similaire dans les processeurs de données techniques avec AMD Ryzen Embedded R2312.

AMD A12-9720P Voir
AMD Ryzen 3 5425C Voir
AMD Ryzen 3 PRO 5475U Voir
AMD Ryzen 7 6980U Voir
AMD Ryzen 7 PRO 6850U Voir
AMD Ryzen 7 PRO 6860Z Voir
AMD Ryzen Embedded R2312 Voir

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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AMD Ryzen Embedded R2312

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