AMD Ryzen Embedded R2312
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Q2/2022
AMD Ryzen Embedded R2312

Prozessor AMD Ryzen Embedded R2312, Spezifikationen und Benchmarks

Der AMD Ryzen Embedded R2312 Prozessor wird in FP5 Sockel-Platinen installiert und arbeitet mit einer Frequenz von 2.70 GHz. Der AMD Ryzen Embedded R2312 hat insgesamt 2 / 4 Kerne. Erscheinungsdatum: Q2/2022. TDP beträgt 15 W. Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum AMD Ryzen Embedded R2312 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf AMD Ryzen Embedded R2312 laufen.

Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Serie
  • CPU Gruppe
    AMD Ryzen Embedded R2000
  • Segment
    Desktop / Server
  • Generation
    2
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

AMD Ryzen Embedded R2312. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • CPU Cores / Threads
    2 / 4
  • Zentrale Architektur
    normal
  • Kerne
    4x
  • Hyperthreading / SMT
    Ja
  • Übertaktung
    Nein
  • Frequenz
    2.70 GHz
  • Turbo Frequency (1 Core)
    3.50 GHz
  • Turbo Frequency (2 Cores)
    3.10 GHz
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    AMD Radeon Vega 3 Graphics
  • GPU frequency
    1.20 GHz
  • GPU (Turbo)
    kein Turbo
  • Ausführungseinheiten
    3
  • Shader
    192
  • Max. GPU Memory
    2 GB
  • Max. displays
    3
  • Generation
    8
  • Direct X
    12
  • technisches verfahren
    14 nm
  • Datum der Veröffentlichung
    Q1/2018
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    Nein
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    DDR4-2400
  • Max. Speicher
    32 GB
  • Speicherkanäle
    2
  • Bandwidth
    38.4 GB/s
  • ECC
    Ja
  • PCIe
    3.0 x 8
  • AES-NI
    Ja
Energieverbrauch
  • TDP (PL1)
    15 W
  • TDP (PL2)
    --
  • TDP up
    25 W
  • TDP down
    12 W
  • Maximale Temperatur
    105 °C
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    x86-64 (64 bit)
  • ISA-Erweiterungen
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • L2-Cache
    1.00 MB
  • L3-Cache
    2.00 MB
  • Architektur
    Zen+
  • Spezifikation
    --
  • technisches verfahren
    12 nm
  • Virtualisierung
    AMD-V, SVM
  • Steckdose
    FP5
  • Datum der Veröffentlichung
    Q2/2022
  • Part Number
    --
Positionen in allen Ranglisten

Gemeinsame Standpunkte AMD Ryzen Embedded R2312 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    698 place

Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of AMD Ryzen Embedded R2312 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
Die Leistung der iGPU - der internen GPU in Spielen.
480
476
476
461
AMD Ryzen Embedded R2312

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit AMD Ryzen Embedded R2312.

AMD A12-9720P Siehe
AMD Ryzen 3 5425C Siehe
AMD Ryzen 3 PRO 5475U Siehe
AMD Ryzen 7 6980U Siehe
AMD Ryzen 7 PRO 6850U Siehe
AMD Ryzen 7 PRO 6860Z Siehe
AMD Ryzen Embedded R2312 Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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AMD Ryzen Embedded R2312

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