HiSilicon Kirin 935 contre HiSilicon Kirin 920. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Génération
  3 2
• Groupe de CPU
  HiSilicon Kirin 930 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.50 GHz 1.30 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  2.20 GHz 1.70 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.70 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Cortex-A15
• B core
  4x Cortex-A53 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-T628 MP4 ARM Mali-T628 MP4
• GPU frequency
  0.68 GHz 0.60 GHz
• GPU (Turbo)
  0.68 GHz 0.60 GHz
• Unités d'exécution
  4 4
• Shader
  64 64
• Max. displays
  1 1
• Génération
  Midgard 2 Midgard 2
• DirectX Version
  11 11
• Processus technologique
  32nm 32nm
• Date de sortie
  Q4/2012 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Decode / Encode
• VP9
  Non Non
• VP8
  Decode / Encode Decode / Encode
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by HiSilicon Kirin 920 et HiSilicon Kirin 935. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-1600 LPDDR3-1600
• ECC
  Non Non
• Canaux de mémoire
  2 2

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 935 et HiSilicon Kirin 920 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 935 et HiSilicon Kirin 920, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A15 / Cortex-A7
• Processus technologique
  28 nm 28 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2015 Q3/2014