MediaTek Helio A22 contre Qualcomm Snapdragon 680 4G. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Helio Qualcomm Snapdragon
• Groupe de CPU
  MediaTek Helio A22 Qualcomm Snapdragon 680
• Segment
  Mobile Mobile
• Génération
  1 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Architecture de base
  normal hybrid (big.LITTLE)
• Hyperthreading / SMT
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  PowerVR GE8300 Qualcomm Adreno 610
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  1 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Shader
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Génération
  6
• Direct X
  10 12.1
• Processus technologique
  20 nm 11 nm
• Date de sortie
  Q1/2017 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode
• h265 / HEVC (10 bit)
  Non Decode
• h264
  Non Decode / Encode
• VP8
  Non Decode
• VP9
  Non Decode
• AV1
  Non Non
• AVC
  Non Decode
• VC-1
  Non Decode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 680 4G et MediaTek Helio A22. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-3200 LPDDR4X-2133
• Max. Mémoire
  3 GB 4 GB
• Canaux de mémoire
  1 2
• Bandwidth
  -- 17.0 GB/s
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio A22 et Qualcomm Snapdragon 680 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio A22 et Qualcomm Snapdragon 680 4G, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A53 / Cortex-A53 Kryo 265
• Processus technologique
  16 nm 6 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q2/2020 Q1/2022
• Part Number
  -- SM6225
• Operating systems
  Android Android