MediaTek Helio P95 contre Qualcomm Snapdragon 850. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Helio Qualcomm Snapdragon
• Groupe de CPU
  MediaTek Helio P65/P90/P95 Qualcomm Snapdragon 845
• Segment
  Mobile Mobile
• Génération
  3 5
• Modèle précédent
  MediaTek Helio P90 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  PowerVR GM 9446 Qualcomm Adreno 630
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  3 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Shader
  12 256
• Max. GPU Memory
  2 GB 8 GB
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  1 4
• Processus technologique
  12 10 nm
• Date de sortie
  Q3/2017 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Non Decode
• VP9
  Non Decode
• AV1
  Non Non
• AVC
  Non Decode
• VC-1
  Non Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 et MediaTek Helio P95. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-1866 LPDDR4X-1866
• Max. Mémoire
  8 GB 8 GB
• Canaux de mémoire
  2 4
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P95 et Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P95 et Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A75 / Cortex-A55 Kryo 385
• Processus technologique
  12 nm 10 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q1/2020 Q3/2018
• Part Number
  -- SDM850