MediaTek Helio P95 gegen Qualcomm Snapdragon 850. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Helio P65/P90/P95 Qualcomm Snapdragon 845
• Segment
  Mobile Mobile
• Generation
  3 5
• Vergangenes Modell
  MediaTek Helio P90 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR GM 9446 Qualcomm Adreno 630
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  3 0
• Shader
  12 256
• Max. GPU Memory
  2 GB 8 GB
• Max. displays
  0 2
• Generation
  1 4
• technisches verfahren
  12 10 nm
• Datum der Veröffentlichung
  Q3/2017 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode
• VP9
  Nein Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 und MediaTek Helio P95. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P95 und Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P95 und Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Cortex-A75 / Cortex-A55 Kryo 385
• technisches verfahren
  12 nm 10 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2020 Q3/2018
• Part Number
  -- SDM850