Qualcomm Snapdragon 662 contre Qualcomm Snapdragon 665. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Génération
  7 7
• Groupe de CPU
  Qualcomm Snapdragon 662/665 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.80 GHz 1.80 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  2.00 GHz 2.00 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.80 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 260 Gold 4x Kryo 260 Gold
• B core
  4x Kryo 260 Silver 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 610 Qualcomm Adreno 610
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Génération
  6 6
• DirectX Version
  12.1 12.1
• Processus technologique
  11 nm 11 nm
• Date de sortie
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Non Non
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 et Qualcomm Snapdragon 662. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933LPDDR4X-1866 LPDDR3-1866LPDDR4X-1866
• ECC
  Non Non
• Canaux de mémoire
  2 2

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 662 et Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 662 et Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 260 Kryo 260
• Processus technologique
  11 nm 11 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2020 Q2/2019
• Part Number
  SM6115 SM6125