Qualcomm Snapdragon 662 versus Qualcomm Snapdragon 665. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Geração
  7 7
• Grupo CPU
  Qualcomm Snapdragon 662/665 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.80 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.00 GHz 2.00 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.80 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 260 Gold 4x Kryo 260 Gold
• B core
  4x Kryo 260 Silver 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 610 Qualcomm Adreno 610
• GPU (Turbo)
  Sem turbo Sem turbo
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Geração
  6 6
• DirectX Version
  12.1 12.1
• Processo técnico
  11 nm 11 nm
• Data de lançamento
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Não Não
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 e Qualcomm Snapdragon 662. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3-933LPDDR4X-1866 LPDDR3-1866LPDDR4X-1866
• ECC
  Não Não
• Canais de memória
  2 2

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 662 e Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 662 e Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Arquitectura
  Kryo 260 Kryo 260
• Processo técnico
  11 nm 11 nm
• Socket
  N/A N/A
• Data de lançamento
  Q1/2020 Q2/2019
• Part Number
  SM6115 SM6125