Qualcomm Snapdragon 690 contre Qualcomm Snapdragon 888. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Génération
  8 8
• Groupe de CPU
  Qualcomm Snapdragon 690 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.70 GHz 1.80 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  2.00 GHz 2.84 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.40 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Kryo 560 Gold 1x Kryo 680 Prime
• B core
  6x Kryo 560 Silver 3x Kryo 680 Gold
• C core
  -- 4x Kryo 680 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 619L Qualcomm Adreno 660
• GPU frequency
  0.95 GHz 0.84 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Génération
  6 6
• DirectX Version
  12.1 12.1
• Processus technologique
  8 nm 5 nm
• Date de sortie
  Q4/2020 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Non Non
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 et Qualcomm Snapdragon 690. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-1866 LPDDR4X-4266LPDDR5-3200
• ECC
  Non Non
• Canaux de mémoire
  2 4

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 690 et Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 690 et Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architecture
  Kryo 560 Kryo 680
• Processus technologique
  8 nm 5 nm
• Socket
  N/A N/A
• Date de sortie
  Q4/2020 Q1/2021
• Part Number
  SM6350 --