Qualcomm Snapdragon 690 gegen Qualcomm Snapdragon 888. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  8 8
• CPU Gruppe
  Qualcomm Snapdragon 690 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.70 GHz 1.80 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.00 GHz 2.84 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.40 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Kryo 560 Gold 1x Kryo 680 Prime
• B core
  6x Kryo 560 Silver 3x Kryo 680 Gold
• C core
  -- 4x Kryo 680 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 619L Qualcomm Adreno 660
• GPU frequency
  0.95 GHz 0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Generation
  6 6
• DirectX Version
  12.1 12.1
• technisches verfahren
  8 nm 5 nm
• Datum der Veröffentlichung
  Q4/2020 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 und Qualcomm Snapdragon 690. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-4266LPDDR5-3200
• ECC
  Nein Nein
• Speicherkanäle
  2 4

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 690 und Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 690 und Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architektur
  Kryo 560 Kryo 680
• technisches verfahren
  8 nm 5 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2020 Q1/2021
• Part Number
  SM6350 --