HiSilicon Kirin 820E 5G
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Libéré
Q1/2021
HiSilicon Kirin 820E 5G

Processeur HiSilicon Kirin 820E 5G, spécifications et caractéristiques de référence

Le processeur HiSilicon Kirin 820E 5G est installé sur des cartes avec un socket N/A et fonctionne à une fréquence de 1.84 GHz. Le HiSilicon Kirin 820E 5G compte un total de 8 cœurs. Date de sortie : Q1/2021. Le TDP est de 6 W. Cet aperçu vous donnera toutes les spécifications techniques et des données détaillées sur le processeur HiSilicon Kirin 820E 5G. Découvrez tout pour savoir si un jeu ou un logiciel fonctionnera sur le HiSilicon Kirin 820E 5G.

Spécifications

Données techniques
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Série
  • Génération
    6
  • Groupe de CPU
    HiSilicon Kirin 810/820
  • Modèle précédent
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 820E 5G. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Fréquence
    1.84 GHz
  • Cœurs de CPU
    8
  • Turbo (1 cœur)
    2.22 GHz
  • Fils de processeur
    8
  • Turbo (8 Cores)
    1.84 GHz
  • Hyperthreading
    Non
  • Overclocking
    Non
  • Architecture de base
    hybrid (big.LITTLE)
  • A core
    3x Cortex-A76
  • B core
    3x Cortex-A55
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nom du GPU
    ARM Mali-G57 MP6
  • GPU frequency
    0.85 GHz
  • GPU (Turbo)
    Pas de turbo
  • Unités d'exécution
    6
  • Shader
    96
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Génération
    Vallhall 1
  • DirectX Version
    12
  • Processus technologique
    7 nm
  • Date de sortie
    Q2/2020
Prise en charge des codecs matériels

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Decode
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Type de mémoire
    LPDDR4X-2133
  • Max. Mémoire
  • ECC
    Non
  • Canaux de mémoire
    4
  • Version PCIe
  • Couloirs PCIe
Cryptage

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Non
Consommation d'énergie
  • TDP (PL1)
    6 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Température maximale
    --
* voir ci-dessous
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Jeu d'instructions (ISA)
    ARMv8-A64 (64 bit)
  • Virtualization
    None
  • Extensions ISA
  • L2-Cache
    --
  • L3-Cache
    2.00 MB
  • Architecture
    Cortex-A76 / Cortex-A55
  • Processus technologique
    7 nm
  • Socket
    N/A
  • Date de sortie
    Q1/2021
  • Part Number
    --
Positions dans tous les classements

Positions communes HiSilicon Kirin 820E 5G CPU dans des benchmarks populaires, pour comparaison avec d'autres modèles.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    573 place
  • AnTuTu 8 benchmark
    41 place

Benchmarks

Tests de performance CPU

Compare the benchmark scores of HiSilicon Kirin 820E 5G with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
Les performances de l'iGPU - le GPU interne dans les jeux.
607
588
581
579
HiSilicon Kirin 820E 5G
AnTuTu 8 benchmark
Le benchmark AnTuTu 8 teste les processeurs ARM en simulant les performances des navigateurs et des applications pour Android, iOS, AI, SoC.
377455
361498
354320
351366
HiSilicon Kirin 820E 5G

Synonymes

Processeurs similaires en termes de performances.

Similaire dans les processeurs de données techniques avec HiSilicon Kirin 820E 5G.

HiSilicon Kirin 985 5G Voir
HiSilicon Kirin 820 5G Voir
HiSilicon Kirin 820E 5G Voir
HiSilicon Kirin 970 Voir
Qualcomm Snapdragon 660 Voir
Qualcomm Snapdragon 660 non LTE Voir

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

Évaluez le processeur
HiSilicon Kirin 820E 5G

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