HiSilicon Kirin 820E 5G
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Lançado
Q1/2021
HiSilicon Kirin 820E 5G

Processador HiSilicon Kirin 820E 5G, especificações e padrões de referência

O processador HiSilicon Kirin 820E 5G é instalado em placas com socket N/A e opera a uma frequência de 1.84 GHz. O HiSilicon Kirin 820E 5G possui um total de 8 núcleos. Data de lançamento: Q1/2021. TDP é 6 W. Esta análise fornece todas as especificações técnicas e dados detalhados sobre o processador HiSilicon Kirin 820E 5G. Descubra tudo para saber se o jogo ou software funcionará no HiSilicon Kirin 820E 5G.

HiSilicon Kirin 820E 5G Especificações

Dados técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Série
  • Geração
    6
  • Grupo CPU
    HiSilicon Kirin 810/820
  • Modelo passado
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 820E 5G. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequência
    1.84 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    2.22 GHz
  • Roscas de CPU
    8
  • Turbo (8 Cores)
    1.84 GHz
  • Hyperthreading
    Não
  • Overclocking
    Não
  • Arquitectura central
    hybrid (big.LITTLE)
  • A core
    3x Cortex-A76
  • B core
    3x Cortex-A55
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nome da GPU
    ARM Mali-G57 MP6
  • GPU frequency
    0.85 GHz
  • GPU (Turbo)
    Sem turbo
  • Unidades de execução
    6
  • Shader
    96
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Geração
    Vallhall 1
  • DirectX Version
    12
  • Processo técnico
    7 nm
  • Data de lançamento
    Q2/2020
Suporte de codec de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Decode
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memória
    LPDDR4X-2133
  • Máx. Memória
  • ECC
    Não
  • Canais de memória
    4
  • Versão PCIe
  • Pistas PCIe
Criptografia

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Não
Consumo de energia
  • TDP (PL1)
    6 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver abaixo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Conjunto de instruções (ISA)
    ARMv8-A64 (64 bit)
  • Virtualização
    None
  • Extensões ISA
  • Кеш L2
    --
  • Кеш L3
    2.00 MB
  • Arquitectura
    Cortex-A76 / Cortex-A55
  • Processo técnico
    7 nm
  • Socket
    N/A
  • Data de lançamento
    Q1/2021
  • Part Number
    --
Posições em todos os rankings

Posições comuns HiSilicon Kirin 820E 5G CPU em padrões de referência populares, para comparação com outros modelos.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    573 place
  • AnTuTu 8 benchmark
    41 place

HiSilicon Kirin 820E 5G Benchmarks

Testes de desempenho CPU

Compare the benchmark scores of HiSilicon Kirin 820E 5G with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
O desempenho do iGPU - o GPU interno em jogos.
607
588
581
579
HiSilicon Kirin 820E 5G
AnTuTu 8 benchmark
O AnTuTu 8 Benchmark testa os processadores ARM simulando o desempenho do navegador e da aplicação para Android, iOS, AI, SoC.
377455
361498
354320
351366
HiSilicon Kirin 820E 5G

Sinónimos

Processadores semelhantes em termos de desempenho.

Similar em processadores de dados técnicos com HiSilicon Kirin 820E 5G.

HiSilicon Kirin 985 5G Ver
HiSilicon Kirin 820 5G Ver
HiSilicon Kirin 820E 5G Ver
HiSilicon Kirin 970 Ver
Qualcomm Snapdragon 660 Ver
Qualcomm Snapdragon 660 non LTE Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 820E 5G

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