HiSilicon Kirin 810 contro HiSilicon Kirin 820 5G. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generazione
  6 6
• Gruppo CPU
  HiSilicon Kirin 810/820 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.90 GHz 1.84 GHz
• Core della CPU
  8 8
• Turbo (1 Core)
  2.20 GHz 2.36 GHz
• Threads della CPU
  8 8
• Turbo (8 Cores)
  2.20 GHz 2.36 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 4x Cortex-A76
• B core
  6x Cortex-A55 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-G52 MP6 ARM Mali-G57 MP6
• GPU frequency
  0.85 GHz 0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  16 6
• Shader
  288 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generazione
  Bifrost 2 Vallhall 1
• DirectX Version
  12 12
• Processo tecnico
  12 nm 7 nm
• Data di rilascio
  Q1/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820 5G e HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  6 GB
• ECC
  No No
• Canali di memoria
  4 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 e HiSilicon Kirin 820 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 e HiSilicon Kirin 820 5G, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• L3-Cache
  1.00 MB 2.00 MB
• Architettura
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Processo tecnico
  7 nm 7 nm
• Presa
  N/A N/A
• Data di rilascio
  Q2/2019 Q2/2019